? semiconductor components industries, llc, 2017 november, 2017 ? rev. 0 1 publication order number: lc898124ep3xc/d lc898124ep3xc optical image stabilization (ois) / open-auto focus (af) controller & driver integrating an on-chip 32-bit dsp overview lc898124ep3xc is a system lsi integrating an onchip 32 ? bit dsp, an eeprom and peripherals including analog circuits for ois (optical image stabilization) / open ? af (auto focus) control and constant current drivers. features ? on ? chip 32 ? bit dsp ? built ? in software for digital servo filter ? built ? in software for gyro filter ? memory ? eeprom ? rom ? sram ? peripherals ? ad converter: input 4 ? ch ? da converter: output 2 ? ch ? 2 ? wire serial i/f circuit (with clock stretch function) ? hall bias circuit x2 ? ch ? hall amp x2 ? ch ? osc (oscillator) ? ldo (low drop ? out regulator) ? digital gyro i/f for various types of gyro (spi bus) ? interrupt i/f ? driver ? ois constant current linear driver (x2 ? ch, i full = 200 ma) ? op ? af (bidirection) constant current linear driver (x1 ? ch, i full = 130 ma) ? package ? wlcsp27 (3.89 mm x 1.30 mm), thickness max. 0.33 mm, with back coat ? pb ? free and halogen free compliance ? power supply voltage ? ad / da / vga / ldo / osc: avdd30 = 2.6 v to 3.3 v ? driver: vm = 1.8 v to 3.3 v ? 1.8 v i/o: iovdd = 1.7 v to 3.3 v ? core logic: generated by on ? chip ldo dvdd15 = typ. 1.59 v ? this device is pb ? free and halogen free www. onsemi.com wlcsp27, 3.89x1.30, 0.4p case 567nj scale 4:1 see detailed ordering and shipping information on page 8 of this data sheet. ordering information
lc898124ep3xc www. onsemi.com 2 block diagram figure 1. block diagram mon1 ain0 ain1 ain2 ain3 mon2 11 bit adc opinpy opinmy opinpx opinmx hlybo hlxbo vgax vgay dac ctrl adc ctrl system ctrl 1.25 kbyte (320word 32 bit) work ram: dma0 2.5kbyte (640word 32 bit) work ram: dmb 20 kbyte (4096word 40 bit) program rom dma0 dmb dmio data program lpdsp32 spi (master/slave) (d ? gyro i/f) current linear ctrl e2prom i/f 128byte eeprom dsp less (for test) h ? bridge driver monitor osc osc typ. 45 mhz (2.8 v) clock divider mona monb monc mond scl sda sda scl dgssb1 dgsclk dgdata eirq out1 out2 out3 out4 out5 out6 vm pgnd por ldo typ. 1.59 v avdd30 avss host cpu (master) digital gyro (slave) hall x hall y port i2c (slave) 8bit dac ldpo(dvdd15 ) c1 10 kbyte (2048word 40 bit) program ram int cmos sensor 1.8v 1.25 kbyte (320word 32 bit) work ram: dma1 dma1 1.8v c1 mon1 iout0 iout1 aout0 aout1 ldopo2(dvdd18 ) 1uf dgssb2 8bit dac sw0 sw1 sw2 sw3 sw4 sw5 sw6 sw7 sw8 sw9 sw10 sw11 sw12
lc898124ep3xc www. onsemi.com 3 application diagram figure 2. application diagram lens vcm hall sensor ois/op ? af actuator position (ois) eeprom cmos sensor digital gyro digital gyro ap/isp ois/af driver i 2 c spi lc898124ep3xc pin layout table 1. bottom view c out4 out3 out2 out1 opinpx hlxbo mon2 eirq dgdata b vm pgnd opinpy opinmy opinmx hlybo iovdd sda dgsclk a out5 out6 avss avdd30 ldpo mon1 dgssb2 scl dgssb1 1 2 3 4 5 6 7 8 9 driver vdd/vss internal vdd output driver table 2. pin description no. pin i/o i/o spec primary function sub functions init 1 mon1 b servo monitor analog in/out 2 ? wire serial data z interrupt input 2 mon2 b servo monitor analog in/out 2 ? wire serial clock z 3 scl b od 2 ? wire serial host i/f clock slave z 4 sda b od 2 ? wire serial host i/f data slave z 5 iovdd p i/o power 6 dgssb2 b digital gyro data i/f chip select2 out (3/4 ? wire master) u 7 dgssb1 b digital gyro data i/f chip select1 out (3/4 ? wire master) digital gyro data i/f chip select in (3/4 ? wire slave) z 8 dgsclk b digital gyro data i/f clock out (3/4 ? wire master) digital gyro data i/f clock in (3/4 ? wire slave) z 9 eirq b od interrupt input digital gyro data i/f data in (4 ? wire master/slave) z
lc898124ep3xc www. onsemi.com 4 table 2. pin description (continued) no. init sub functions primary function i/o spec i/o pin 10 dgdata b digital gyro data i/f data (3 ? wire master) digital gyro data i/f data out (4 ? wire master/slave) z digital gyro data i/f data (3 ? wire slave) 11 hlxbo o ois hall x bias output z 12 hlybo o ois hall y bias output z 13 opinmx i ois hall x opamp input minus z 14 opinpx i ois hall x opamp input plus ? 15 opinmy i ois hall y opamp input minus ? 16 opinpy i ois hall y opamp input plus ? 17 out1 o ois driver output z 18 out2 o ois driver output z 19 out3 o ois driver output z 20 out4 o ois driver output z 21 out5 o open ? af driver output z 22 out6 o open ? af driver output z 23 avdd30 p analog power ? 24 avss p analog gnd ? 25 vm p driver power ? 26 pgnd p driver gnd 27 ldpo p internal v ldo power output 1. process when pins are not used: pin type ?o? ? ensure that it is set to open. pin type ?i? ? open is inhibited. ensure that it is connected to the v dd or v ss even when it is unused. (please contact on semiconductor for more information about selection of v dd or v ss .) pin type ?b? ? if you are unsure about processing method on the pin description of pin layout table, please contact us. 2. note that incorrect processing of unused pins may result in defects.
lc898124ep3xc www. onsemi.com 5 electrical characteristics table 3. absolute maximum ratings (at avss = 0 v, pgnd = 0 v) parameter symbol conditions ratings unit power supply voltage v ad 30 max ta 25 c ? 0.3 to +4.6 v vm max ta 25 c ? 0.3 to +4.6 v io max ta 25 c ? 0.3 to +4.6 input/output voltage v ai 30, v ao 30 ta 25 c ? 0.3 to v ad 30 +0.3 v v mi 30, v mo 30 ta 25 c ? 0.3 to v m 30 +0.3 v ii , v ioo ta 25 c ? 0.3 to v io 18 +0.3 v storage temperature tstg ? 55 to +125 c operating temperature topr1 read for eeprom ? 30 to +85 c topr2 program & erase for eeprom ? 30 to +70 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. table 4. allowable operating ratings (at t a = ? 30 to +85 c, avss = 0 v, pgnd = 0 v) parameter symbol min typ max unit power supply voltage v ad 30 2.6 2.8 3.3 v input voltage range v ina 0 ? v ad 30 v 3.0 v power supply (vm) power supply voltage v m 30 1.8 2.8 the lower of 3.3 and avdd30 +0.5 v input voltage range v inm 0 ? v m 30 v 1.8 v power supply (iovdd) power supply voltage v io 1.7 1.8 3.3 v input voltage range v ini 0 ? v io v functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresse s beyond the recommended operating ranges limits may affect device reliability. table 5. d. c. characteristics: input/output (at t a = ? 30 to +85 c, avss = 0 v, pgnd = 0 v, avdd30 = 2.6 to 3.3. v) parameter symbol conditions min typ. max unit applicable pins high ? level input voltage vih cmos schmitt 0.75iovdd v dgssb1, dgsclk dgdata,eirq dgssb2 low ? level input voltage vil 0.25iovdd v high ? level input voltage vih 1.4 v scl,sda low ? level input voltage vil 0.4 v scl,sda high ? level input voltage vih 0.75avdd30 v mon1,mon2 low ? level input voltage vil 0.25avdd30 v high ? level output voltage voh ioh = ? 2 ma iovdd ? 0.2 v dgssb1, dgsclk dgdata, dgssb2
lc898124ep3xc www. onsemi.com 6 table 5. d. c. characteristics: input/output (continued) (at t a = ? 30 to +85 c, avss = 0 v, pgnd = 0 v, avdd30 = 2.6 to 3.3. v) parameter applicable pins unit max typ. min conditions symbol low ? level output voltage vol iol = 2 ma 0.2 v dgssb1, dgsclk dgdata,eirq dgssb2 high ? level output voltage voh ioh = ? 2 ma avdd30 ? 0.3 v mon1,mon2 low ? level output voltage vol iol = 2 ma 0.3 v low ? level output voltage vol iol = 2 ma 0.2 v scl,sda, analog input voltage vai avss avdd30 v mon1,mon2 pull up resistor rup 20 250 k dgssb1, dgsclk dgdata mon1,mon2 hlxbo,hlybo dgssb2 pull down resistor rdn 20 250 k dgssb1, dgsclk dgdata,eirq mon1,mon2 hlxbo,hlybo dgssb2 table 6. driver output (at t a = 25 c, v ss = 0 v, pgnd = 0 v, avdd30 = vm = 2.8 v) parameter symbol condition min typ max unit output current out1 to out4 ifull full code 190 200 210 ma output current out5, out6 full code op ? af(bidirection) 123.5 130 136.5 ma outputon resistance out1 to out4 ron full code total on resistance ? 2.2 ? output on resistance out5, out6 full code total on resistance ? 2.2 ? 3. calculation method of max. current(imax): rcoil : coil resistance of actuator rb : wiring resistance of the board vm / (rcoil + rb + ron) ifull; imax = ifull vm / (rcoil + rb + ron) < ifull; imax = vm / (rcoil + rb + ron) *these parameters do not depending on this lsi. please use the appropriate value. table 7. non ? volatile memory characteristics item symbol condition min typ max unit applicable circuit endurance en 1000 cycles eeprom data retention rt 10 years eeprom write time twt 20 ms product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions.
lc898124ep3xc www. onsemi.com 7 ac characteristics v dd supply timing figure 3. v dd supply timing avdd30 vm, iovdd tr vbot 10% 2.6 v tw table 8. v dd supply timing item symbol min typ max units rise time tr 3 ms wait time tw 100 ms bottom voltage vbot 0.2 v injection order between avdd30 and vm, iovdd is below. figure 4. 2.6 v 2.6 v 0.2 v 0.2 v tvmav tavio 0.2 v 2.6 v tavvm 0.2 v tioav iovdd avdd30 vm 2.6 v table 9. v dd supply timing item symbol min typ max units iovdd on to avdd30 on tioav 0 ms avdd30 on to vm on tavvm 0 ms vm off to avdd30 off tvmav 0 ms avdd30 off to iovdd off tavio 0 ms 4. vm avdd30 +0.5 v 5. when iovdd is power off, it is prohibition to apply the voltage to a 1.8 v pins*. *dgssb1,dgclk,dgdata,eirq,dgssb2 sda, scl, eirq tolerate 3 v input at the time of power off. the data in the eeprom may be rewritten unintentionally if you do not keep specifications. and it is forbidden to power off during eeprom access. the data in the eeprom may be rewritten unintentionally. ois driver and af driver are recommended to set standby before vm power off.
lc898124ep3xc www. onsemi.com 8 ac specification the figure below shows interface timing definition and following table shows electric characteristics. the communication protocol is compatible with i 2 c (fast mode plus). this circuit has clock stretch function. figure 5. 2 ? wire serial interface timing definition tbuf tsu,sto thd,sta tsu,sta tsu,dat thd,dat tlow tr tf thd,sta scl sda vihmin vilmax tf tr start condition repeated condition stop condition start condition vihmin table 10. electric characteristics for 2 ? wire serial interface (ac characteristics) item symbol pin name min typ max units scl clock frequency fscl scl 1000 khz start condition hold time thd,sta scl sda 0.26 s scl clock low period tlow scl 0.5 s scl clock high period thigh scl 0.26 s setup time for repetition start condition tsu,sta scl sda 0.26 s data hold time thd,dat scl sda 0 (note 6) 0.9 s data setup time tsu,dat scl sda 50 ns sda, scl rising time tr scl sda 120 ns sda, scl falling time tf scl sda 120 ns stop condition setup time tsu,sto scl sda 0.26 s bus free time between stop and start tbuf scl sda 0.5 s 6. although the i 2 c specification defines a condition that 300 ns of hold time is required internally. this lsi is designed for a condition with typ. 40 ns of hold time. if sda signal is unstable around falling point of scl signal, please implement an appropriate treatment on board, such as inserting a resistor. ordering information table 11. ordering information table device package shipping (qty / packing) ? lc898124ep3xc ? mh wlcsp27, 3.89 x 1.30, 0.4p (pb ? free / halogen free) 4000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
lc898124ep3xc www. onsemi.com 9 package dimensions case 567nj issue o seating plane 0.05 c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. coplanarity applies to spherical crowns of solder balls. 2x dim a min max ??? millimeters d 3.89 bsc e b 0.12 0.22 e 0.40 bsc 0.33 d e a b pin a1 reference e a 0.05 b c 0.03 c 0.08 c 27x b 4 c b a 0.13 c a1 c 1.30 bsc 0.17 27x dimensions: millimeters *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 0.40 0.40 0.05 c 2x top view side view bottom view note 3 e recommended package outline 123 pitch pitch a1 a detail a die coat detail a 567 89 a1 0.04 ref on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent ? marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 lc898124ep3xc/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative ?
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